|
|
The work focuses on the thermally induced deformations caused by the
processing of Flip Chip Ball Grid Arrays (FCBGA). Analytical expressions
for substrate displacements are derived based on the Plate Theory and
Suhir's solution for stresses in tri-material assembly. The validity of
the model is established by comparing the analytical solution to the
numerical finite element results as well as to the experimental data.
The benefits of the proposed model are twofold: 1) it provides a tool
for fundamental understanding of the deformation process of interest,
and 2) has a predictive capability. More specifically, an analysis is
presented on the nature and degree of influence that different geometric
and material parameters have on the substrate deflections, as well as a
``Warpage Contour Plot'', proposed as a tool for warpage prediction that
can be easily utilized in the early stages of the design process. |
|
